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High-Productivity Silicon Wafer Disc Grinder



JTEKT offers the DXSG320, a double-disc horizontal grinder that simultaneously grinds both sides of silicon wafers to +/- 1 micron from as-sliced condition.

Interior of the DXSG320 wafer grinder showing two wafers in position for grinding.

JTEKT offers a double-disc horizontal grinder that simultaneously grinds both sides of silicon wafers to +/- 1 micron from as-sliced condition. "The DXSG320 performance represents a massive improvement in accuracy and productivity over the single-spindle vertical grinders common in the chip industry today, which grind to 3-4 microns," said a company spokesperson. "A further advantage, the DXSG320 grinder footprint is approximately 20% smaller than other machines while including fully automated work handling internal to the machine."

Wafers are put into a fixture and loaded into a rack system to carry the wafers into the machine for sizing and finishing to customer specifications. To help ensure correct stock removal and optimum quality, wafer thickness is measured before and after grinding. During grinding, discs float in the fixtures and spin during the grinding process, resulting in rapid, even material removal. Since there is no need to flip over the part during the grinding process, users save cycle time. According to the company, the machine's single wafer grinding method makes for ease of automation and easy traceability.

"An advantage this machine offers over the vertical spindle design is equal stock removal on both sides of the disc in one operation," said the spokesperson. "This reduces the need for multiple machines to achieve desired production levels."

Key features of the grinder include a GW high frequency spindle with air static pressure and a built-in motor to achieve high speed, high accuracy grinding. In-process wheel positioning is automatic through high accuracy air gauging. The use of pure water instead of coolant is environmentally friendly. The machine is compatible with a variety of data collection systems through easy-to-use communication software.

For more information contact:

John Quick

JTEKT Machinery Americas Corporation

316 W University Drive

Arlington Heights, IL 60004

847-253-0340

jquick@jtektmachinery.com

www.jtektmachinery.com

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